Sequre T55 Mini Hot Plate SMD Soldering Rework Station

If you’ve ever encountered the intricate task of mounting SMD components, or even trickier, the delicate process of removing components from PCBs, you’ll know that it can be quite a challenge, if not impossible using a soldering iron. That’s where a hot plate such as the T55 comes in handy. Armed with the T55 and some solder paste, tackling SMD components becomes a breeze. Removing components too, with a bit of luck also becomes easier. It’s simply a case of heating up the PCB and then using tweezer to lift the components away from the board.

The T55 has a relatively small 55x55mm work area, which makes it more suited to assembling small PCBS. It does however offer an advantage for reworking jobs, where it’s beneficial to be able to concentrate the heat in a limited area of the PCB being worked on.

The T55 allows users to set an appropriate operating temperature, ranging from 50°C-280°C. It heats up quickly, around 90 seconds from from 30°C to 280°C. The unit has a clear OLED display showing the operating temperature and settings.

The T55 requires a USB-C PD power supply, common these days as laptop power supplies. To make life simpler, we are including a 65W power supply with the T55. If you wish to power it from a drone LiPo, we sell a XT60 to USB-C power lead here.

Features:

• Adjustable heating temperature range from 50℃ to 280℃/122℉ to 536℉.
• Intelligent temperature control algorithm, supports temperature compensation & power adjustment.
• Power Input: Supports PD, QC, DC Max 25V.
• OLED display and built-in buzzer to remind work condition.
• Supports ℃/℉

Please be careful when using this device. Treat a Hot Plate as though it was an open flame. Do not leave unattended.

The basic process for soldering a PCB that has SMT parts (source https://reprap.org/wiki/HotplateReflowTechnique – more info here):

• 1. Apply Solder Paste to all the SMT pads.
• 2. Place all SMT components in the appropriate place.
• 3. Heat up the entire board to melt the solder and solder all parts simultaneously.
• 4. After the board has cooled, fix any solder bridges.
• 5. Solder in the remaining through-hole parts, if any.